MEMS Accelerometer

In applications where precision and durability are essential, such as in automotive, aerospace, and industrial systems, MEMS accelerometers provide exceptional performance under extreme conditions. These sensors are designed to withstand high shock, vibration, and temperature fluctuations, ensuring reliable measurements even in the most demanding environments.

Our MEMS accelerometers are engineered for accuracy and longevity, featuring advanced technology to maintain consistent performance. Whether for motion detection, tilt sensing, or vibration monitoring, these accelerometers offer high sensitivity and minimal drift, making them ideal for a variety of applications.

A total of2pages
  • ACM-200
    The ACM-200 tri-axis accelerometer is a widely used acceleration sensor series product produced by Micro-Magic Inc Hi-Tech Company with Swiss patented technology, which can be used in various fields such as vibration testing and impact testing. The product adopts output interface with 4~20mA and 0~20mA. Different address codes can be set, and multiple sensors can be connected in series for long-distance measurement and data analysis at multiple points. ACM-200 is a single crystal silicon capacitive sensor, consisting of a silicon chip that has undergone micro mechanical processing, a low-power ASIC for signal adjustment, a microprocessor for storing compensation values, and a temperature sensor.
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  • ACM-100
    The ACM-100 tri-axis accelerometer is a widely used acceleration sensor series product produced by Micro-Magic Inc Hi-Tech Company with Swiss patented technology, which can be used in various fields such as vibration testing and impact testing. The product adopts digital interface output, with RS232, RS485, TTL, Modbus protocol, and RS422 optional. Different address codes can be set, and multiple sensors can be connected in series for long-distance measurement and data analysis at multiple points. ACM-100 is a single crystal silicon capacitive sensor, consisting of a silicon chip that has undergone micro mechanical processing, a low-power ASIC for signal adjustment, a microprocessor for storing compensation values, and a temperature sensor.
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